Global High Density Interconnect Market Report, Ongoing Trends, Growth Factors, Negative Factors, Opportunities, Untapped Markets, Strategies and Developments, Product Segments, and Forecast 2020 – 2029
“Global High Density Interconnect Market Trends, Products, Applications, End Use, Opportunities, Growth Forecast to 2029” is a recently created report offered by MarketResearch.biz, which is estimated to be worth US$ X Mn in the current year and is projected to witness CAGR of X % by the end of forecast period. The global high density interconnect market report has been segmented on the basis of product, end user, application, and region/ country.
High Density Interconnect: An Overview
High density interconnect offers various advantages, specifically in performance, package size, and weight. The combination of all these properties makes it particularly attractive for application in handheld devices, wearable and mobile electronics by manufacturers. Manufacturing of high density interconnect PCBs require specially-designed equipment and procedures such as plugging, laser drills, sequential lamination cycles, and laser direct imaging, among others.
High density interconnect (HDI) circuit boards have thin lines, tight annular rings, tight spacing, and need thin specialty materials, and it takes time-consuming procedures and higher investments to successfully manufacture these types of boards. These boards comprise of buried and blind vias and mostly comprise of micro-vias with .006 diameter or even less, and have comparatively higher circuit density than conventional circuit boards.
Global High Density Interconnect Market: driver & Restraints
Rapid industrialization in developed and developing countries, technological advancements in electronic devices resulting in miniaturization of devices, and flourishing consumer electronic device market, coupled with increasing demand for high density interconnect from consumer electronic devices manufacturers are major factors driving the global market growth. In addition, increasing spending capacity, and rising adoption of smart wearables and devices by consumers are some other factors projected to further support the market growth. Moreover, rising inclination of consumers towards the adoption of connected devices and wide applicability in medical devices are some other factors expected to support the target market growth to certain extent.
However, the complex manufacturing process and high cost of certain products are among the key factors that could hamper the market growth to some extent.
Increasing technological advancements in this field by major players, coupled with increasing merger & acquisition activities for the development of innovative products are factors projected to present significant revenue opportunities for players functioning in the market in the next 10 years.
Segment Analysis: Global High Density Interconnect Market
By Product, Analysis:
Amid the segments based on the end products, the 8–10 layers HDI segment is estimated to record major share in terms of value and projected to witness significant growth rate over the 10-year forecast period.
By End User, Analysis:
Among the segments based on the end users, the automotive segment is estimated to record the largest revenue share and register high CAGR over the next few years due to rising global production and sales of automobiles. For instance, as per 2018 report by the European Automobile Manufacturers Association, in 2017, over 80 Mn passenger cars were manufactured across the globe. In addition to this, in 2018, around 98.1 Mn motor vehicles were manufactured globally.
By Application, Analysis:
Among the segments based on the wide range of applications, the wearable devices segment is anticipated to register substantially higher CAGR over the 10-year period owing to increasing inclination towards technologically advanced products.
Region Analysis: Global High Density Interconnect Market
The Asia Pacific (APAC) market is estimated to record largest market share in the global market in terms of value and is anticipated to continue its dominance over the 10-year forecast period. This is due to flourishing consumer electronics sector and robust presence of prominent companies in economies such as India and China in APAC market. The North America market is estimated to record significantly high share in terms of value in the market, and Europe market is estimated to record second-largest revenue share in the market. Increasing mergers, acquisitions and joint ventures among international players are projected to further support market growth in the regions to significant extent.
Global High Density Interconnect Market Segmentation:
Segmentation by Product:
- 4–6 Layers HDI
- 8–10 Layers HDI
- 10+ Layers HDI
Segmentation by End User:
- Consumer Electronics
Segmentation by Application:
- Automotive Electronics
- Computer and Display
- Communication Devices and Equipment
- Audio/Audiovisual (AV) Devices
- Connected Devices
- Wearable Devices
Segmentation by Region:
- North America
- Asia Pacific
- Latin America
- Middle East & Africa
Particular Scope Region
- North America
- Rest of Europe
- Asia Pacific
- South Korea
- Rest of Asia Pacific
- Latin America
- Rest of Latin America
- Middle East and Africa
- South Africa
- Rest of Middle East and Africa
Actual Year 2020 Estimated Year 2021 Forecast Period 2021–2030 Revenue in US$
- Unimicron Technology Corporation
- Compeq Manufacturing Co., Ltd.
- TTM Technologies, Inc.
- Austria Technologie & Systemtechnik AG
- Zhen Ding Technology Holding Limited
- IBIDEN Co., Ltd.
- Meiko Electronics Co., Ltd.
- Fujitsu Interconnect Technologies Limited
- Tripod Technology Corp.
- Unitech Limited
- Samsung Electro-Mechanics Co., Ltd.
- Daeduck GDS Co., Ltd.
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