Global Thin Wafer Market Analysis, Drivers, Restraints, Opportunities, Threats, Trends, Applications, and Growth Forecast to 2027

MarketResearch.biz delivers in-depth insights on the global thin Wafer market in its upcoming report titled, “Global Thin Wafer Market Trends, Applications, Analysis, Growth, and Forecast: 2017 to 2027”. The global thin Wafer market is estimated to register a CAGR of X.X% in terms of value during forecast period 2017–2027. The report offers in-depth insights, revenue details, and other vital information regarding the target market, and the various trends, drivers, restraints, opportunities, and threats till 2027. The report offers insightful and detailed information regarding the various key players operating in the market, their financials, supply chain trends, technological innovations, key developments, apart from future strategies, acquisitions & mergers, and market footprint. The global thin Wafer market report has been segmented on the basis of product type and region.

This report is based on synthesis, analysis, and interpretation of information gathered regarding the target market from various sources. Our analysts have analyzed the information and data and gained insights using a mix of primary and secondary research efforts with the primary objective to provide a holistic view of the market. In addition, an in-house study has been made of the global economic conditions and other economic indicators and factors to assess their respective impact on the market historically, as well as the current impact in order to make informed forecasts about the scenarios in future.

Thin wafer, also known as substrate or slice of semiconductor material, is an electronic component used in integrated circuits (ICs) for fabrication and in solar cells, as well as, photovoltaics. Wafer is used as solid substrate in microcontroller devices and undergoes process of etching, deposition, and iron implant. It is commonly made with pure crystalline semiconductor material such as germanium, silicon, etc. Size of the wafer varies from 25 mm to 300 mm.

Growing demand for more compact and technologically advanced electronic devices among consumers is a major factor driving growth of the global thin wafer market. Increasing usage of mobile phones among individuals globally and increasing number of electronic devices users are factors resulting into increasing size of the market. Wafer saves material required for production of the device which is another factor expected to propel growth of the global market. Growing adoption of new technology among individuals in developing, as well as, developed countries can boost growth of the global thin wafer market in the near future.

However, limited diameter and use of expensive silicon for production of thin wafer may hamper growth of the global thin wafer market. In addition, efficiency maintenance is another factor expected to affect growth of the target market. Nonetheless, high adoption of portable electronic devices and growing number of integrated circuit production companies can create high revenue opportunities for players in the thin wafer market.

The market in Asia Pacific is expected to account for major share in terms of revenue, owing to increasing number of semiconductor devices manufacturing companies in this region. The market is also expected to witness significant growth in terms of revenue over the forecast period. Increasing number of consumers and low labor cost are factors boosting growth of the global thin wafer market in this region. Currently, the market in North America accounts for second highest share in terms of revenue and is expected to maintain its position in the near future, followed by Europe, Latin America, and Middle East and Africa. Presence of major companies and increasing government support for regional electronic components production are factors expected to drive growth of the target market in North America region.

Global Thin Wafer Market Segmentation:

By wafer size:

• 125mm
• 200mm
• 300mm

By application:

• Micro-Electro-Mechanical Systems (MEMS)
• Complementary Metal–Oxide–Semiconductor (CMOS) Image Sensors
• Radio-Frequency (RF) Devices
• Light-Emitting Diode (LEDs)
• Logic
• Interposers

By region:

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

• LG Siltronic, Inc.
• Shin-Etsu Chemical Co., Ltd.
• Siltronic AG
• SUMCO Corporation
• SunEdison Semiconductor Limited
• SÜSS MicroTec AG
• LINTEC Corporation
• Disco Corporation
• 3M Company
• Applied Materials, Inc.