Global Semiconductor Packaging Material Market Trends, Analysis, Growth, and Forecast: 2017 to 2026

MarketResearch.biz delivers in-depth insights on the global semiconductor packaging material market in its upcoming report titled, “Global Semiconductor Packaging Material Market Trends, Applications, Analysis, Growth, and Forecast: 2017 to 2026”. The global semiconductor packaging material market is estimated to register a CAGR of X.X% in terms of value during forecast period 2017–2026. The report offers in-depth insights, revenue details, and other vital information regarding the target market, and the various trends, drivers, restraints, opportunities, and threats till 2026. The report offers insightful and detailed information regarding the various key players operating in the market, their financials, supply chain trends, technological innovations, key developments, apart from future strategies, acquisitions & mergers, and market footprint. The global semiconductor packaging material market report has been segmented on the basis of material type, application, and region.

This report is based on synthesis, analysis, and interpretation of information gathered regarding the target market from various sources. Our analysts have analyzed the information and data and gained insights using a mix of primary and secondary research efforts with the primary objective to provide a holistic view of the market. In addition, an in-house study has been made of the global economic conditions and other economic indicators and factors to assess their respective impact on the market historically, as well as the current impact in order to make informed forecasts about the scenarios in future.

Semiconductor packaging material plays an important role in protection of IC chips from external impact and ensuring connection for chip mount on printed wiring boards. There are various types of materials used for packaging of semiconductors according to requirement and features.

Technological advancements in packaging material is expected to drive growth of the global semiconductor packaging material market. Many leading players are focusing on product improvement and development such as development of lower CTE substrate materials for warpage control, thinner substrates for packages in mobile products and many more.

Increasing advancements in consumer electronic products leading to increasing demand for mobile phone and other electronic equipment expected to support growth of the global semiconductor packaging material market.

Moreover, growth of electronic industry in emerging countries such as India is another factor expected to propel growth of the target market. Furthermore, ongoing smart city projects and electronic vehicle penetration in emerging countries as well as in developed countries supporting growth of the global semiconductor packaging material market.

However, increasing labor cost and raw material cost is a major factor restraining growth of the global semiconductor packaging material market. Also, stringent competition among leading players resulting affecting product price and resulting into low profit margin, which is an another factor expected to affect growth of the target market up to a certain extent.

Asia Pacific market dominates the global semiconductor packaging material market in terms of revenue contribution as compared to that of markets in other regions. This is mainly attributed to strong presence of leading electronic industry players as well as availability of cost effective labors in countries in the region.

North America accounts for second-largest revenue share contribution to the global semiconductor packaging material market, followed by markets in the Europe, Latin America, and the Middle East & Africa respectively. The market in the North America and Europe is projected to register comparatively faster growth in terms of revenue over the forecast period, owing to increasing investment into electronic industry by leading players of the target market and increasing consumer electronic product penetration in countries in the region.

Global semiconductor packaging material market segmentation, by material type:

• Lead frames
• Organic substrates
• Ceramic packages
• Encapsulation resins
• Bonding wire
• Die attach material
• Others

Global semiconductor packaging material market segmentation, by application:

• Consumer electronics equipment
• Commercial electronics equipment
• Industrial electronics equipment
• Others

Global semiconductor packaging material market segmentation, by region:

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

• Hitachi Chemical Co. Ltd.
• Henkel AG & Company
• BASF SE
• Honeywell International Inc.
• Sumitomo Chemical Co. Ltd.
• Kyocera Chemical Co. Ltd.
• Alent plc
• Amkor Technology, Inc.
• I. du Pont de Nemours and Company (DuPont)
• Toppan Printing Co., Ltd.
• Beijing Kehua New Chemical Technology
• ASM International