Global Semiconductor Packaging Material Market Trends, Analysis, Growth, and Forecast: 2017 to 2026
The Semiconductor Packaging Material Market report offers in-depth insights, revenue details, and other vital information regarding the target market, and the various trends, drivers, restraints, opportunities, and threats till 2022.
The Semiconductor Packaging Material Market report offers insightful and detailed information regarding the various key players operating in the market, their financials, supply chain trends, technological innovations, key developments, apart from future strategies, acquisitions & mergers, and market footprint.
The global semiconductor packaging material market report has been segmented on the basis of material type, application, and region.
This Semiconductor Packaging Material Market report is based on the synthesis, analysis, and interpretation of information gathered regarding the target market from various sources.
Our analysts have analyzed the information and data and gained insights using a mix of primary and secondary research efforts with the primary objective to provide a holistic view of the market.
In addition, an in-house study has been made of the global economic conditions and other economic indicators and factors to assess their respective impact on the market historically, as well as the current impact in order to make informed forecasts about the scenarios in the future.
Semiconductor Packaging Material Market Overview:
“The Semiconductor Packaging Material Market size is expected to be worth around US$ xx Billion by 2021 from US$ X.xx million in 2031, growing at a CAGR of X.x% during the forecast period 2021 to 2031.”
Semiconductor packaging material plays an important role in the protection of IC chips from external impact and ensuring connection for chip mount on printed wiring boards. There are various types of materials used for packaging semiconductors according to requirements and features.
Technological advancements in packaging material are expected to drive the growth of the global semiconductor packaging material market.
Many leading players are focusing on product improvement and development such as the development of lower CTE substrate materials for warpage control, thinner substrates for packages in mobile products, and many more.
Increasing advancements in consumer electronic products leading to increasing demand for mobile phones and other electronic equipment are expected to support the growth of the global semiconductor packaging material market.
Moreover, the growth of the electronic industry in emerging countries such as India is another factor expected to propel the growth of the target market.
Furthermore, ongoing smart city projects and electronic vehicle penetration in emerging countries as well as in developed countries support the growth of the global semiconductor packaging material market.
However, increasing labor costs and raw material costs are major factors restraining the growth of the global semiconductor packaging material market.
Also, stringent competition among leading players results in affecting product price and resulting in a low-profit margin, which is another factor expected to affect the growth of the target market up to a certain extent.
Asia Pacific market dominates the global semiconductor packaging material market in terms of revenue contribution as compared to that of markets in other regions.
This is mainly attributed to the strong presence of leading electronic industry players as well as the availability of cost-effective labor in countries in the region.
North America accounts for the second-largest revenue share contribution to the global semiconductor packaging material market, followed by markets in Europe, Latin America, and the Middle East & Africa respectively.
The market in North America and Europe is projected to register comparatively faster growth in terms of revenue over the forecast period, owing to increasing investment in the electronic industry by leading players of the target market and increasing consumer electronic product penetration in countries in the region.
Semiconductor Packaging Material Market Segmentation:
Global semiconductor packaging material market segmentation, by material type:
- Lead frames
- Organic substrates
- Ceramic packages
- Encapsulation resins
- Bonding wire
- Die attach material
Global semiconductor packaging material market segmentation, by application:
- Consumer electronics equipment
- Commercial electronics equipment
- Industrial electronics equipment
Global semiconductor packaging material market segmentation, by region:
- North America
- Asia Pacific
- Latin America
- Middle East & Africa
Attribute Report Details Market Size Ask For Market Size Growth Rate Ask For Growth Rate Key Companies Ask For Companies Report Coverage Revenue analysis, Competitive landscape, Key company analysis, Market Trends, Key segments, Distribution Channel, Market Dynamics, COVID-19 Impact Analysis and more… Historical Data Period 2015-2020 Base Year 2022 Forecast Period 2022-2031 Region Scope North America, Europe, Asia-Pacific, South America, Middle East & Africa Country Scope United States, Canada and Mexico, Germany, France, UK, Russia and Italy, China, Japan, Korea, India and Southeast Asia, Brazil, Argentina, Colombia etc.Saudi Arabia, UAE, Egypt, Nigeria and South Africa Revenue in US$ Mn
- Hitachi Chemical Co. Ltd.
- Henkel AG & Company
- BASF SE
- Honeywell International Inc.
- Sumitomo Chemical Co. Ltd.
- Kyocera Chemical Co. Ltd.
- Alent plc
- Amkor Technology, Inc.
- I. du Pont de Nemours and Company (DuPont)
- Toppan Printing Co., Ltd.
- Beijing Kehua New Chemical Technology
- ASM International
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