Global Potting Compound Market Trends, Applications, Analysis, Growth, and Forecast to 2028

“Global Potting Compound Market Analysis Trends, Applications, Analysis, Growth, and Forecast to 2028” is a recent report generated by MarketResearch.biz. The global potting compound market report has been segmented on the basis of resin type, curing technique, application, end-use industries, and region.

Introduction                                                                                                                                                                              

Potting compounds are utilized as a covering or coating for electrical and electronics devices to guard it from the surrounding environment. Potting compounds offer protection from moistness and also provide flame retardancy, heat dissipation, and shock resistance. Potting compounds are utilized for concealing components from the fire. Potting compounds have various applications in aerospace, industrial, electrical and electronics, energy & power, automotive, solar power, and marine industries.

Dynamics

Increasing demand for potting compound across different end-use industries such as aviation, automotive, and marine is a major factor expected to drive growth of the global market in the next few years. In addition, increasing adoption of potting compound in various electronics applications such as beam bonded components, surface mount package, microprocessors and memory devices, and high power devices is another factor estimated to drive growth of the global market over next 10 years. Moreover, increasing adoption of these compound in various electrical applications such as capacitors, cable joints, transformers, solenoids, and industrial magnets is another key factor projected to drive growth of the global market over next few years.

In addition, increasing spending by various end-use industries including transportation and consumer electronics for potting compound, coupled with growing demand for electronic devices miniaturization are other factors expected to drive growth of the target market.

However, established electronic and transportation industries in developed countries is a major factor expected to hamper growth of the global market to certain extent.

Segmental Analysis:

On the basis of resin type, epoxy resin segment is estimated to register major share in terms of revenue in the global potting compound market, owing to various characteristics offered by these products such as better adhesion, chemical and high temperature resistance, higher rigidity, high tensile strength, and enhanced moisture resistance. The epoxy resin segment revenue is estimated to register highest CAGR over the forecast.

On the basis of application, electronics segment is expected to register significant share in term of revenue in the global potting compound market, owing to increasing adoption of these potting compounds in transportation, aviation, consumer electronics, marine, solar power, energy and power, and other sectors by various major industrial producers. The electronics segment revenue is estimated to register largest CAGR over the forecast.

Regional Analysis:

Asia Pacific potting compound market is expected to account for major share in terms of revenue in the global market. Asia Pacific potting compound market is estimated to register faster growth in terms of revenue over the next few years, owing to increasing adoption of potting compounds in various electronics and electrical applications. In addition, increasing demand for electronic devices miniaturization in different end-use industries such as transportation and consumer electronics is another factor expected to drive growth of the global market over the forecast period.

Global potting compound market segmentation:

Segmentation by resin type:

• Epoxy Resin
• Polyurethane Resin
• Silicone Resin
• Others (Polyester System and Polyamides)

Segmentation by curing technique:

• Room Temperature Cured
• High Temperature or Thermally Cured
• UV Cured

Segmentation by application:

• Electronics (Surface Mount Package, Beam Bonded Components, Memory Devices and Microprocessors, and High Power Devices)
• Electricals (Capacitors, Transformers, Cable Joints, Industrial Magnets, and Solenoids)

Segmentation by end-use industries:

• Consumer Electronics
• Transportation (Automotive, Aviation, and Marine)
• Energy & Power

Segmentation by region:

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa