Global Liquid Encapsulation Market Trends, Applications, Analysis, Growth, and Forecast to 2028

“Global Liquid Encapsulation Market Analysis Trends, Applications, Analysis, Growth, and Forecast to 2028” is a recent report generated by MarketResearch.biz. The global liquid encapsulation market report has been segmented on the basis of resin type, product, application, and region.

Introduction                                                                                                                                                                              

Liquid encapsulation process which includes coating of materials such as metal, ceramics, and polymer on devices in form of liquid or solid to protect devices form moisture and shock. To safeguard functioning of electronic devices and to overwhelmed misconnection of the electrical components liquid encapsulant materials are used.

Encapsulation is advanced packaging process for all types of semiconductor devices that offer low warpage, high thermal conductivity, and low stress. Liquid encapsulant materials contain epoxy modified resin and epoxy resin materials. Solid encapsulant materials contain epoxy-molding compounds that are blend of hardeners, fillers, solid epoxy resins, flame retardants, and various other additives. Liquid encapsulant has similar compositions, but hardener and resin are liquid and allow material to be applied directly onto chip, they interconnect by wire bonding process. Moreover, encapsulants are of three types, includes, ceramic, metal, & glass (hermetic type), polymer (near-hermetic package (NHP)), and plastic (non-hermetic type).

Liquid encapsulation plays an important role in the functions of a device and helps to prevent malfunctioning of components in electronic devices. In addition, liquid encapsulation materials are widely used in the electronics and semiconductor industry where large and small components are required to be mount in various devices.

Dynamics

Increasing demand for liquid encapsulation across different end-use industries such as automotive and telecommunication is a major factor expected to drive growth of the global market in the next few years. In addition, increasing adoption of liquid encapsulation in various electronics and electrical applications is another key factor projected to drive growth of the global market over next 10 years.

In addition, rising demand for advanced the packaging techniques, coupled with trend of reduction of electronic products size are other factors expected to drive growth of the target market. Rising demand for the consumer electronics products is another key factor expected to propel growth of the target market over the forecast period.

However, sluggish demand for the liquid encapsulat in various countries in developed regions is a major factor expected to hamper growth of the target market to certain extent.

Segmental Analysis:

On the basis of resin type, epoxy resin segment is expected to register moderate share in terms of revenue in the global liquid encapsulation market. The epoxy resin segment revenue is projected to register fastest CAGR over the forecast period.

On the basis of application, electronics and electrical segment is estimated to register major share in term of revenue in the global liquid encapsulation market. The electronics and electrical segment revenue is anticipated to register largest CAGR over the forecast period.

Regional Analysis:

Asia Pacific liquid encapsulation market is expected to account for significant share in terms of revenue in the target market. Asia Pacific liquid encapsulation market is expected to register fastest growth in terms of revenue over the next 10 years, owing to increasing adoption of liquid encapsulations in various automotive and electronics and electrical applications.

Global liquid encapsulation market segmentation:

Segmentation by resin type:

• Epoxy Resins
• Epoxy-Modified Resins

Segmentation by product:

• Integrated Circuits
• Optoelectronics
• Discrete Semiconductors
• Sensors

Segmentation by application:

• Automotive
• Electronics
• Telecommunication
• Industrial Sectors

Segmentation by region:

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa