Global Flip Chip Technology Market Analysis, Drivers, Restraints, Opportunities, Threats, Trends, Applications, and Growth Forecast to 2028
“Global Flip Chip Technology Market Analysis Trends, Applications, Analysis, Growth, and Forecast to 2028” is a recent report generated by MarketResearch.biz. The global flip chip technology market report has been segmented on the basis of wafer bumping process, product, application, and region.
Flip chip is a technique used for interconnecting semiconductor devices including IC chips to an external circuitry using solder bumps that are dumped onto chip pads. In addition, flip chip semiconductor interconnecting devices are widely used in multiple electronic products such as medical devices, smartphones, and PCs, among others. Flip chip offers various benefits such as increased packaging density, reduced thickness and size, improved performance of chip, lower cost, improved reliability, and improved thermal capabilities.
Flip chips are utilized for traditional various applications including laptops, chipsets, CPU, GPU, etc. Flip chips are widely used in mobile and wireless applications, and various other high performance applications including networks, data centers, and servers. Flip chip is used in emerging Internet of things (IoT): vehicles, buildings, network of physical devices, and other items that involve embedded electronics, sensors, actuators, software, network connectivity along with technological advancements over conventional wire bond electrical connection.
Rapid development in Internet of things (IoT), advancements in flip chip technology as compared to traditional wire bond electrical connection, and rising demand for high-performing and miniaturization electronic devices are major factors expected to fuel growth of the global flip chip technology market. Moreover, various advantages offered for electronic devices (smartphones, camcorders and digital camera, laptops and tablets, household electronics, and wearable electronics), such as reduced height and weight, smaller IC footprint, improved performance, enhanced thermal capabilities, and better reliability is additional factor estimated to drive the global flip chip technology market growth.
Increasing adoption of flip chip technology in different end-use industry including applications in IT and telecommunication, automotive and transport, consumer electronics, industrial, aerospace and defense, and healthcare, among others is another factor expected to fuel growth of the global market in the next few years. In addition, increasing demand for flip chip technology services from various renewable energy resources is another factor projected to drive the target market growth.
However, high initial investment cost for setting up manufacturing plant and less customization options are major factors estimated to hamper growth of the target market.
Among the wafer bumping process segments, the copper pillar segment is estimated to account for major share in terms of revenue in the global flip chip technology market. This is attributed to high demand for finer pitches, lithography nodes below 28nm, higher I/O counts, emergence of 2.5D/3D packaging, and thermal dissipation needs, and increased current density.
Among the application segments, the consumer electronics segment is expected to account for major share in terms of revenue in the global flip chip technology market.
The Asia Pacific market is expected to account for major share in terms of revenue in the target market. This is attributed to demand from consumer electronics sector, especially from tablets and smartphones. The market in Asia Pacific is projected to register fastest GAGR, owing to presence of major manufacturing base and high adoption rate of adoption of advanced technologies in countries in the region.
Global Market Segmentation:
Global market segmentation, by Wafer Bumping Process:
- Copper (Cu) Pillar
- Tin/lead Eutectic Solder
- Gold Plated Solder
Global market segmentation, by Product:
- CMOS Image sensor
- RF, analog, mixed signal, and power IC
- Others (CPU, SoC, and GPU)
Global market segmentation, by Application:
- Consumer electronics
- Industrial sector
- Medical devices
- Others (Smart technologies and Military & aerospace)
Global market segmentation, by Region:
- North America
- Asia Pacific
- Latin America
- Middle East & Africa
Particular Scope Region
- North America
- Rest of Europe
- Asia Pacific
- South Korea
- Rest of Asia Pacific
- Latin America
- Rest of Latin America
- Middle East and Africa
- South Africa
- Rest of Middle East and Africa
Actual Year 2019 Estimated Year 2020 Forecast Period 2020–2029 Revenue in US$
- Taiwan Semiconductor Manufacturing Company Limited
- Samsung Electronics Co., Ltd.
- Intel Corporation
- United Microelectronics Corporation
- ASE Group
- Amkor Technology, Inc.
- Siliconware Precision Industries Co., Ltd.
- Powertech Technology Inc.
- STATS ChipPAC Pte. Ltd.
- Jiangsu Changjiang Electronics Technology Co., Ltd.
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